Flip and Chip
vlsi assignment 1;section 1;group 4
Uploaded: November 30, 1999 at 12:00 am
Author: kyckwo
Length: 03:16
Rating: 2.9285715
Views: 13101
Tags: flip chip technology
Nepes Pte., Ltd. is the first 12-inch wafer bumping foundry that has advanced into Singapore. It concentrates its efforts on solder bumping of high-tech semiconductors,...
Uploaded: November 30, 1999 at 12:00 am
Author: nepeshr
Length: 06:45
Rating: 5.0
Views: 2991
Tags: wafer semiconductor bumping business nepes
Movie shows thermosonic bonding with FINEPLACER Die Bonder, more information at www.finetech.de/enid/picoma
Uploaded: November 30, 1999 at 12:00 am
Author: fineplacer
Length: 03:02
Rating: N/A
Views: 3974
Tags: Thermosonic Bonding flip chip die bonder
A VIA Centaur employee solders a dual-core Nano die onto a BGA package.
Uploaded: November 30, 1999 at 12:00 am
Author: anandshimpi
Length: 03:12
Rating: 5.0
Views: 4053
Tags: P1000990
Bonding chips by NCP,onto paper strap web printed by inkjet silver ink with a high density layout Please also check out our conductive inkjet printing:...
Uploaded: November 30, 1999 at 12:00 am
Author: amchauhongkong
Length: 01:23
Rating: N/A
Views: 203
Tags: Radio-frequency Identification Flip chip RFID
Genesis SC Single Beam machine bonding flip chips on singulated substrates.
Uploaded: November 30, 1999 at 12:00 am
Author: UICSEMICONDUCTOR
Length: 02:56
Rating: N/A
Views: 226
Tags: Flip Chip Singulated substrates Genesis Wafer Feeder
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